HP will use the funding to establish a “lab-to-fab” facility tasked with researching microelectromechanical systems (MEMS) technology, which integrates mechanical and electrical components on chips.
The funding will help HP expand research and manufacturing of MEMS devices, creating approximately 150 construction jobs and more than 100 manufacturing jobs.
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HP President and CEO Enrique Lores said the funding will “strengthen U.S. semiconductor production and innovation.”
“This important development will accelerate our efforts and innovation in MEMS technology, directly benefiting the U.S. semiconductor and life sciences industry, as well as strengthening our global competitiveness.” added.
Following an initial agreement in August 204, HP was given the green light for the project by the Department of Commerce, with access to federal funding contingent on completion of project milestones.
“Companies like HP are developing technologies that will fuel unprecedented breakthroughs for generations to come,” said U.S. Secretary of Commerce Gina Raimondo. “By investing in companies and R&D projects across the semiconductor ecosystem, the Biden-Harris Administration will build and secure domestic semiconductor capabilities that will help the United States compete with and continue to excel against the rest of the world. Contributing to
HP’s final deal is the latest in a growing list of signed CHIPS Act deals as the Commerce Department prepares for the incoming Trump administration.
Last week, Hemlock Semiconductor (HSC) announced $325 million in funding, with deals with Corning and Powerlex, as well as approvals for new research facilities for packaging innovation and virtual chip manufacturing starting the year. I successfully obtained it.
President-elect Trump has said he would replace federal aid provided by the CHIPS Act with tariffs.
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