TSMC does not seem to stop semiconductors, as the Taiwanese giants are currently determined to expand the process technology to incorporate the latest 1NM process.
The TSMC 1NM process will be debuted by 2030. The Taiwanese giant will bring Moore’s law into a new range
We do not deny that TSMC has now become the world’s largest casting. There is no serious competition. The gap between other casting companies has expanded when TSMC grasped a considerable share of NVIDIA’s AI instructions and did not give Samsung and Intel Foundry an opportunity to challenge. According to a Taiwanese economic daily report, TSMC plans to confuse market competition by preparing a 1NM production line at new cutting -edge facilities.
The report states that the TSMC 1NM node is expected to be mass -produced in a dedicated facility in Teinan, Taiwan. Fab is said to be labeled as “FAB 25”, and it is expected that six production lines will generate 12 inch wafers. Apart from 1NM, TSMC plans to build a new facility for the future 2Nm and 1.4nm process. This is also the case with TAINAN because the government provides incentives and how it evolves. “Silicon Valley” is a semiconductor -centered.
Let’s briefly see the TSMC 1NM process. Returning to the IEDM meeting, TSMC shared a plan to develop a 1NM node by 2030. Interestingly, the company showed optimism about integrating the “trural trangista” into the process through multiple 3D stack chipsets. TSMC changes its naming scheme after 2nm, labels the 1.4nm and 1nm process as A14 and A10, and has similarities to Intel Foundry.
However, the yield rate and supply have become a major problem in recent semiconductor industries, especially how the processing has accelerated in the past few years, so TSMC has succeeded in achieving this goal. 。 TSMC’s 1NM plan was expensive, and it was said that the estimated cost exceeded 1 trillion won or more than $ 32 billion. Given that 1NM is scheduled for five years, Taiwanese giants still have about five years to understand things.
