According to the Semiconductor Industry Association, global chip sales recorded $56.9 billion in October, up 22% in October 2023. Additionally, in the third quarter of 2024, global semiconductor equipment billing reached $30.38 billion, a 19% increase and a 13% growth QOQ was reported.
TSMC has begun installation of its 2nm Fab equipment in Kaohsiung, Taiwan, and is six months ahead of schedule. Volume production of 2NM technology is scheduled for next year. The company also has been in discussion with Nvidia to produce Blackwell AI chips at TSMC’s Arizona facility, with production preparations underway in early 2025. The production of the front-end occurs in Arizona, but the chips are still shipped to Taiwan as the US lacks Cowos (chip-on-wafer-on-substrate) capacity.
Chip Wars:
The US Department of Commerce (DOC) has announced new restrictions aimed at reducing China’s ability to produce advanced node semiconductors for military applications, including AI and Advanced Weapon Systems. The measurements include control of 24 different semiconductor devices, high bandwidth memory (HBM), and related software tools, as well as 140 entities added to the Entity List. China condemned the latest US lawsuit and subsequently announced a ban on exports to gallium, germanium, antimony and other high-tech materials, citing potential military applications. Doc has also released a report on the use of US companies of legacy chips manufactured by China-based entities.
New US funding:
The new chips law for semiconductor manufacturing components has been signed for up to $33 million (Texas), Skywater Technology Foundry (Minnesota) and X-FAB for $50 million (expanding the Texas SIC Fab). GlobalFoundries has secured $9.5 million in federal funding to promote Gan-on-Silicon Semiconductor Manufacturing at its Vermont facility. This funding supports GF’s efforts to expand production of 200mm Gan chips, essential for high-performance, energy-efficient applications in RF, power control and defense. The US Department of Commerce has confirmed two Chips Act awards. SKC Affiliate Absort was awarded $75 million for a new facility that manufactures glass substrates for advanced packaging. Integris was awarded $77 million to the manufacturing center that produces liquid filtration products and the Front Opening Unintegrated Pod (FOUP).
Microchip shuts down the Arizona Wafer Fab, a Tempe, and suspends the Chips Act funding application, citing excess capacity.
Intel’s shakeup continues after Pat Gelsinger’s sudden departure. Eric Meurice, former CEO/Chairman of ASML and Steve Sanghi, chairman and interim CEO of Microchip, have been appointed to Intel’s board of directors.
The CXL Consortium has released the COMCLE Express Link (CXL) 3.2 specification, which optimizes monitoring and management of CXL memory devices, enhances the capabilities of CXL memory devices in OS and applications, and extends security with reliable security protocols.
Tenstorrent has raised more than $693 million in Series D for its RISC-V-based AI processor IP. This is offered in a customisation and complete system.
The chip industry is looking to quadruple the height of the stack of 3D NAND flashes from 200 to 200 to 800 layers over the next few years.
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Market and money
Recent funds:
Axiado has raised $60 million in Series C, a trusted control/computing unit (TCU), which integrates key infrastructure security and management capabilities into the SOC. Akhetonics raised 6 million euros (~$6.3 million) in seed funds for all optical cross-domain processors.
This week’s revenue report: Synopsys and Marvell.
New Market Report:
The European Semiconductor Industry Association reported on its latest semiconductor market forecasts, predicting strong growth in 2024 and 2025. Global wafer casting revenue increased QOQ by 9.1% in the third quarter of 2024, reaching $34.9 billion in response to AI servers, flagship devices and highly advanced demand. According to Trendforce, the price of 3nm process.
As part of the proposed acquisition of Spirent Communications, Keysight Technologies has announced plans to sell Spirent’s fast Ethernet and network security business line.
The U.S. Department of Energy has awarded $118 million in funding to 10 centers for advanced microelectronics and other regional basic energy research.
detail
Semiconductor Engineering released an extensive automotive, security and computing newsletter this week featuring these top stories.
Details of this week:
global
Nvidia is opening a Vietnam R&D Centre focused on AI.
The Rebellion and Sapeon merged to form South Korea’s first AI chip, Unicorn. The new company will operate under the name “Rebellion” and will be led by CEO Sunghyun Park.
VSMC, a joint venture recently formed by Vanguard and NXP, broke the ground with Singapore’s new $7.8 billion 300mm Wafer Fab.
Semi-Europe issued recommendations for the European Union’s 2024-2029 legislative term, urging policymakers to strengthen European semiconductor ecosystems. Key proposals include optimizing funds for the EU’s target of 20% global market share by 2030, adjusting semiconductor initiatives with the Green Deal, addressing industry talent gaps through education reform and skilled immigration policies. Includes:
The Silicon Europe Alliance, a coalition of European semiconductor/electronic clusters named Frank Bosenberg, Silicon Saxony’s Managing Director, will take over as chairman of the 2025 alliance.
The University of Oxford in the UK will play a leading role in a new lab for AI Security Research, a £8.22 million government-funded initiative to strengthen UK cyber resilience.
The Chicago Planning Commission has approved a plan to rezone more than 400 acres of land at the former US Steel Southworks facility to become a new quantum computing campus, WBEZ reports.
safety
Cyberattack monitoring is a critical component of hardware-based security, but what happens afterwards is just as important. Ensuring that logging and cataloged hardware vulnerabilities do not repeat is essential for security.
The looming threat of quantum computers that destroy today’s encryption and the stockpile of encrypted data in preparation for the time when it can be decrypted continues to plague the security industry.
New and updated publications:
Recent Security Surveys:
Trans: Security Perspective (UC Davis, et al.) If Random is Bad: Selective CRPS (Aalborg University) 0.09-PJ/bit Logic Compatible Multi-Time Programmable (MTP) Memory-Based Design for PUF IoT applications (FudanUniv.etal.)
Products and Partnerships
AlibabaBacked Xreal released AR glasses with an in-house co-processor, creating spatial displays from almost every device and everything the wearer sees.
Advantest has introduced ACS Gemini, a virtual software platform that allows customers to develop and simulate machine learning applications for semiconductor testing.
Bruker has announced the Dimension Nexus Atomic Force Microscope (AFM), designed for cultivation in labs and multi-user facilities.
Cadence and AST Spacemobile have collaborated on AST5000 ASIC (custom, low power architecture) to eliminate connectivity gaps and advance the latter mission of connecting people worldwide with fast, space-based internet access. Ta.
Alphawave Semi has joined the Ultra Accelerator Link Consortium (Ualink), which develops standardized fabric interconnects for Accelerator-to-Accelerator communications.
Marvell has announced the 3nm 1.6 Tbps Pam4 Interconnect platform with 200 Gbps electrical and optical interfaces.
Destination 2D, launched by Stealth to provide CMOS-compatible graphene interconnects, claims to be less resistive, more reliable and more energy efficient than copper interconnects.
MENTA deployed AICOSICICS’ network-on-chip IP to the MOSAICS-LP Chiplet platform, computing AI computing at the edge.
Alice & Bob debuted the roadmap with the aim of producing quantum chips with 100 high fidelity logical qubits by 2030, with the Equal1 multi-powered ARM cortical core running at 300 milliKelvin We have announced a tile quantum controller chip. We also demonstrated high fidelity silicon kit arrays of single and 2 quit gates.
PhysicsX uses high fidelity simulation data generated by the Siemens Xcelerator Portfolio to build modern, pre-trained, deep physics models for aerodynamics.
ANSYS and Cummins use simulations to expand collaboration to pursue carbon neutrality, accelerate Cummin’s time to market, save costs, and improve sustainability across their portfolio of power solutions. did.
Blue Cheetah has signed a strategic sales partnership with Micon Global.
car
An increase in vehicle autonomy fundamentally changes which technologies are chosen, how they are used, interact with each other, and how they evolve throughout the life of the vehicle. I’m doing it.
LG and Ambarella partner with AI-driven in-cabin vehicle safety to enable LG’s DMS to perform real-time analysis of high-resolution video from in-vehicle cameras using Ambarella’s CV25 chipset. did.
Starplus Energy, a JV for Stellantis and Samsung SDI, will be offering conditional US government loans up to $7.54 billion to help fund up to two lithium-ion battery cells and module manufacturing plants in Kokomo, Indiana. You will receive it.
According to NBC, General Motors expects the rebuild of the JV by Chinese SAIC motors to exceed $5 billion. GM has also reached a non-binding agreement to sell shares of Michigan’s Ultium Cells Battery Cell Plant to JV Partner LG Energy Solutions, but GM’s Ultium Cells LLC remains in ownership. .
The EU Commission and the European Investment Bank have partnered to support investment in the EU’s battery manufacturing sector with a 200 million euro loan guarantee to the InvestEU programme from the EU’s Innovation Fund.
the study
The MIT researchers “exemplify a fully integrated photonic processor that can perform all the major calculations of deep neural networks on the chip optically.”
CISPA faculty received 2 million euros of funding from the European Research Council for a project seeking to develop new algorithms for more sustainable and efficient ML.
Three NIST researchers were awarded the 2024 Presidential Ranking Award. John Kitchen, the pioneering low-power chip-scale atomic clock. And John Lehman achieved a transformational task with sensors to measure optical power.
The US Department of Defense and the National Communications and Information Agency have completed a survey of the 37 GHz band (37-37.6 GHz) that led to the shared use framework for this “innovation band” for government and commercial users.
Scientists at Brookhaven National Laboratory mapped the quantum entanglement of protons.
Events and more readings
Check out our upcoming chip industry events, including:
Date Location Event IEDM December 7-11 San Francisco Semicon Japan December 11-13 Tokyo AI Executive Conference: Power of Semi Design and Manufacturing December 12 San Francisco ISS 2025: Industrial Strategy Symposium January 12-15 Half Moon Bay, California IEEE/EPS Hybrid Bonding Symposium January 16-17 Silicon Valley Chiplet Summit January 21-23, 2025 Santa Clara West January 25-30 San Francisco Design Con January 28-30 Santa Clara, California State Santa Clara Webinar Next Generation Terrabit AI Industry First Multiprotocol I/O Connection Chiplet December 10 Online Driving Intelligent System Design 3D-IC Multipurpose Design December 12 Automotive SoC Design December 12 Online , please see here.
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