Intel claims that a module approach to PC design can make the system easier to repair and reduce electronic waste. There are several suggestions.
In a blog post written by Intel trio, X86 BEHEMOTH claims that the current monolithic approach to building devices will usually lead to early disposal, as the components are usually outdated or failed. 。 This suggests that a modular PC architecture can deal with this problem by making it easier to replace parts instead of destroying the entire system.
This idea is consistent with the goal of growing correct answers, proposing designs that prioritize repair and upgrades. Intel says that the modular architecture is considered to be a way to reduce electronic waste and extend the life of devices by making users easier to exchange components.
The chip manufacturer calls a modular PC architecture a “innovative approach.” But remember this writer (there is no doubt with many REG readers). When the disk controller, I/O, and even the display circuit came, remind you of the first PC from the components supplied from many places. Individual plug -in card.
Why is this related today? The author pointed out numbers that indicate that it produces more than 60 million tons of electronic waste every year, recycled less than 12 % in less than 25 % collected. I claim that it is occupied. waste.
This is previously covered by the registration book. According to the United Nations report last year, the world creates electronic waste almost 5 times faster than recycled using a documented method, and the estimated economic and financial costs for E-Waste are 37 billion. I found out that the dollar has reached.
Last year, a group of electronic equipment companies advocated to delete the VAT of electronic spare parts, repair, and labor.
Also, note that at least one company, Framework Computer, has already provided a modular laptop model that users can customize and exchange parts.
Intel’s approach to this issue is to brush three proposals for various market segments, and the versatile approach states that they cannot cope with the subtle demands of these various segments.
These three segments are composed of “Premium Modular PC” (actually laptop design). “Entry/mainstream modular PC” (another laptop); and “desktop modular PC”.
The first one assumes a three -board system, including the core motherboard and the left and right I/O boards of the universal. 20W or 30W.
The entry/mainstream modular PC is similar with a core motherboard and a left and right I/O board, but this segment states that you can redesign them and allow multiple designs in design. Masu. He says that the circuit board is costly here to respond to the mainstream segment.
The desktop modular PC design is displayed from the Intel figure, using a midplane with a platform controller hub (PCH) silicon, and connects to it. These include CPU, memory, and GPU modules, can be remove using slide rails, all of which fit into 5 -liter desktop chassis.
Intel also stated that it has introduced a substructure level exchange module. In fact, this means something like a flexible printing circuit (FPC) or a type C connector on the M.2 circuit board. The idea is that if your port or connector is damaged, you can easily replace the module.
The author of the blog claims that these designs can easily upgrade and components, extend the life of the device, and reduce electronic waste.
According to Intel, this is closely linked with customers and partners, but if it is found to be added to the system cost, the vendors will not be adopted by vendors. ®
